X9 functions and features
1 . Accuracy
X9 special mathematical operation model, printing accuracy ±15 microns (±0.0005″) @6 σ, CpK ≥ 2.0.
2 . HTGD dedicated adjustment platform
The X9’s dedicated high-rigidity UVW module drive mechanism and inverted triangle Z-axis lifting mechanism effectively improve the stability of platform adjustment and achieve ultra-fine transmission under micro-motion adjustment, making the machine meet higher precision printing requirements. The structure is simple, reliable, and easy to adjust. It can quickly realize automatic adjustment of the PIN pin lifting height of PCB boards of different thicknesses.
- Programmable floating self-adjusting stepper motor drives print head
Independent direct-connected stepper motor control, built-in precise pressure control system, can accurately measure the original pressure value of the scraper, without taking into account changes in scraper blade type, length, weight or thickness. Programmable to achieve flexible printing process; for front and rear The blade pressure is different and the stability of the lifting and lowering is required. It is designed to prevent solder paste from leaking and the blade has a certain elastic clamping design. The pressure of the scraper, lifting speed, printing speed, and printing range are all software-adjustable, and provide customers with A variety of demoulding methods are available to adapt to PCB boards with different tin placement requirements, providing customers with a good printing control platform.
- PCB positioning system for HTGD printing presses
Flat belt drive effectively improves the guide rail’s transport capacity and speed; stepper motor drive, programmable to achieve different transport speeds and movements; new concept guide rail, seamless transmission ensures the reliability of PCB transport; adaptive PCB board thickness, more process Simple; software adjustable pressure and elastic side pressure, optional bottom integral suction chamber suction plate vacuum.
- Cleaning system
Automatic cleaning structure; high-power fan and venturi vacuum generating device for vacuuming; three cleaning methods: dry, wet, and vacuum, and can be freely combined at any time. Users can set cleaning cycle, time, speed and other parameters according to actual needs; length Wiping paper is universal, easy to disassemble, and saves resources;
6． Highly adaptable steel mesh frame clamping system
Achieve printing of screen frames of various sizes (470mm x 370mm~737 mm x 737 mm), and enable rapid replacement of machine models during the production process; Y-direction automatic positioning.
- Electronic control system
It adopts self-developed modular integrated circuits, which are safe and easy to maintain; it adopts the industry’s most advanced industrial control system, which allows the machine to modify parameters during movement.
8 . Image and optical system
The new light path system – uniform ring light and high-brightness coaxial light, coupled with the stepless brightness adjustment function, allows all types of Mark points to be easily identified (including uneven Mark points), and is suitable for tin plating. Copper plating, gold plating, tin spraying, FPC and other types of PCBs in different colors. Four-way light sources are adjustable, and the telecentric lens illuminates the steel mesh and PCB board from above and below.
9 . Simple and easy-to-use graphical Chinese/English operation interface
Using Windows XP operating system, independently developed graphical human-machine interface: especially the navigation effect of program files, making it convenient for all operators to quickly become familiar with the operation; menu-based Chinese/English switching, operation logs, fault records/fault self-diagnosis/faults Analysis prompt/light alarm and other functions make the operation simple and convenient.
- 2D solder paste printing quality inspection and SPC analysis
The 2D function can quickly detect printing defects such as offset, missing tin, missed printing, and tin connections, and the detection points can be increased arbitrarily; the SPC software can analyze the machine CPK index through samples collected by the machine to ensure printing quality.
| X9™ Technique Parameter | |
| PCB boarding Handling Paramater | |
| Max. board Size(X x Y) | 450mm x 350mm |
| Min. board Size(X x Y) | 50mm x 50mm |
| PCB thickness Range | 0.4mm~6mm |
| PCB Warpage | Max. PCB diagonal 1% |
| Max. board weight | 3Kg |
| PCB edge clearance | Configurable to 3 mm |
| PCB bottom clearance | 20mm |
| Conveyor speed (Max.) | 1500mm/second(Max) |
| Conveyor height | 900±40mm |
| Conveyor direction | L-R,R-L,L-L,R-R |
| Transfer mode | One stage Conveyor |
| PCB Clamping method | Programmable elastic side pressure + Z upward tablet pressing + bottom integral suction chamber vacuum |
| Support method | Magnetic ejector pin, equal height block, special workpiece fixture. (Option: Grid-Lok) |
| Printing parameters | |
| Printing head | Floating intelligent printing head (two independent direct connected motors) |
| Stencil frame size | 470mm x 370mm~737 mm x 737 mm |
| Max. printing area(X x Y) | 450mm x 350mm |
| Squeegee Material/Angle | Steel squeegee/ Rubber squeegee(Angel 45°/5５°/60° matching the printing process) |
| Squeegee length | 220mm~500mm |
| Squeegee height | 65±1mm |
| Squeegee thickness | 0.25mm Diamond-like carbon coating |
| Print mode | Single or dual squeegee printing |
| Demoulding length | 0.02 mm to 12 mm |
| Print speed | 0 ~ 200 mm/second |
| Print pressure | 0.5kg to 10Kg |
| Print stroke | ±200 mm(From the center) |
| image System | |
| Field of view | 8mm x 6mm |
| Printing table adjustment range | X±5.0mm,Y:±7.0mm, θ : ±2.0 °. |
| Fiducial Types | Standard Fiducial type(Circle, triangle, square, diamond, cross)(SMEMA standard),solder pad/openings |
| Vision methodology | Independent camera,upwards/downwards imaging vision system,geometric matching location |
| Performance parameters | |
| Machine Alignment repeatability | ±10 μm (±0.0005″) @6 σ , Cpk ≥ 2.0 |
| Printing accuracy | ±15 μm (±0.001″) @6 σ , Cpk ≥ 2.0 |
| Core Cycle time | < 7s |
| Product Changeover Time | < 5mins |
| Equipment | |
| Power supply | AC220V±10%,50/60HZ,15A |
| Air supply | 4~6Kg/cm2, 10.0 diameter tube |
| Operating system (OS) | Windows XP |
| External dimension | L（1152mm）x W（1415mm）xH（1520mm） |
| Machine weight | 1000Kg |
| Temperature and humidity control module (optional) | |
| Environment temperature | 23±3℃ |
| Relative humidity | 45～70%RH4 |
English 
Chinese